Non-silicone thermal conductive paste, thermal conductivity 8.0 W/m·K
It is a paste-like thermal conductive material that has a hardness intermediate between thermal conductive grease and thermal conductive sheets.
It is used to fill the gap between the heating element and the heat sink, allowing efficient heat conduction from the heating element to the heat sink. 【Features】 ● Silicone-free (does not use silicone-based materials), so low molecular siloxanes are not generated, eliminating issues such as electrical contact failure. ● Excellent adhesion and conformity to uneven surfaces and curved surfaces, providing reliable thermal conductivity performance. ● High viscosity allows for vertical application without dripping. ● Being clay-like, it can adhere more closely to each component compared to conventional thermal conductive sheets. ● No worries about pump-out. ● Electrically insulating. ● Applied using a dispenser. ● Available as a set with thermal conductive paste and dispenser, thermal conductive paste only, or dispenser only.
- Company：ワイドワーク
- Price：Other
